ACM Research Delivers First Horizontal Panel Electroplating Tool Strengthening Its Leadership in Fan-Out Panel-Level Packaging

ACM’s Extremely ECP ap-p allows subsequent technology machine efficiency amid accelerating market demand for superior packaging

SEMICON EUROPA, Munich, Nov. 16, 2025 (GLOBE NEWSWIRE) — ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a number one provider of wafer and panel processing options for semiconductor and superior packaging functions, right now introduced it has delivered the primary panel electrochemical plating software, the Ultra ECP ap-p, to an industry-leading panel fabrication buyer. This achievement underscores ACM’s development in panel-level electroplating expertise and displays rising market demand for scalable, cost-efficient superior packaging options to satisfy subsequent technology machine necessities.

The Extremely ECP ap-p is the primary industrial panel-level copper deposition system for the large-panel market, supporting plating steps throughout pillar, bump, and redistribution layer (RDL) processes. The system achieves panel-processing efficiency – similar to conventional spherical wafer processes, enabling producers to satisfy demanding machine necessities with better effectivity.

“We’re happy to meet this order for our Extremely ECP ap-p,” mentioned Dr. David Wang, ACM’s President and Chief Government Officer. “This milestone demonstrates our skill to ship high-performance horizontal panel electroplating options via our differentiated expertise that assist clients speed up their fan-out panel-level packaging roadmaps whereas strengthening our function within the superior packaging ecosystem. As demand grows for next-generation units, panel-level packaging gives the scalability, throughput, and price benefits wanted for high-volume manufacturing, which is able to obtain a seamless transition for the {industry} from 300-millimeter wafer packaging to panel-level packaging.”

The system options ACM proprietary horizontal electroplating expertise, and helps copper (Cu), nickel (Ni), tin-silver (SnAg) and a gold (Au) plating. The Cu plating chambers incorporate high-speed plating paddles particularly designed for tall pillar functions, able to reaching pillar heights exceeding 300 microns. The Extremely ECP ap-p incorporates a four-sided sealing dry contact chuck for improved reliability, in-cell rinse performance to attenuate chemical cross-contamination between totally different plating cells, and a horizontal electroplating design synchronizing a rotating sq. electrical area with the rotating chuck for superior deposition uniformity.

To study extra in regards to the Extremely ECP ap-p platform, schedule a meeting with ACM Analysis at sales space C1129 at SEMICON Europa, November 18-21, Messe München, or go to our website.

Ahead-Trying Statements

Sure statements contained on this press launch will not be historic info and could also be forward-looking statements inside the which means of the Non-public Securities Litigation Reform Act of 1995. Phrases reminiscent of “plans,” “expects,” “believes,” “anticipates,” “designed,” and comparable phrases are meant to determine forward-looking statements. Ahead-looking statements are based mostly on ACM administration’s present expectations and beliefs and contain numerous dangers and uncertainties which might be tough to foretell and that might trigger precise outcomes to vary materially from these said or implied by the forward-looking statements. An outline of sure of those dangers, uncertainties and different issues may be present in filings ACM makes with the U.S. Securities and Change Fee, all of which can be found at http://www.sec.gov. As a result of forward-looking statements contain dangers and uncertainties, precise outcomes and occasions might differ materially from outcomes and occasions presently anticipated by ACM. Readers are cautioned to not place undue reliance on these forward-looking statements, which converse solely as of the date hereof. ACM undertakes no obligation to publicly replace these forward-looking statements to replicate occasions or circumstances that happen after the date hereof or to replicate any change in its expectations with regard to those forward-looking statements or the incidence of unanticipated occasions.

About ACM Analysis, Inc.

ACM develops, manufactures and sells semiconductor course of gear spanning cleansing, electroplating, stress-free sprucing, vertical furnace processes, observe, PECVD, and wafer- and panel-level packaging instruments, enabling superior and semi-critical semiconductor machine manufacturing. ACM is dedicated to delivering personalized, high-performance, cost-effective course of options that semiconductor producers can use in quite a few manufacturing steps to enhance productiveness and product yield. For extra data, go to http://www.acmr.com.

© ACM Analysis, Inc. Extremely ECP ap-p and the ACM Analysis brand are emblems of ACM Analysis, Inc. For comfort, these emblems seem on this press launch with out ™ symbols, however that follow doesn’t imply ACM is not going to assert, to the fullest extent beneath relevant regulation, its rights to such emblems. All different emblems are the property of their respective house owners.